Technical specifications
Description | Specificaiotns(Device) | Value | Operating Temp. Range |
|---|---|---|---|
Board Size | PC104 Standard | 90.17 x 99.27 mm | |
MCU | Cell 2-2 | LQFP144 | -40°C to 85°C |
AND | 74LVC1G11-Q100 | -40°C to 125°C | |
CAN BUS | TCAN1051-Q1 | -55°C to 125°C | |
Temp Sensor | MCP9804 | over 8ea | -40°C to 125°C |
Flash Memory | CY15B102Q | over 3ea | -40°C to 125°C |
F-Ram Memory | S25FL256L | over 3ea | -40°C to 125°C |
Ext Clock | Sit8924, ABS07AIG | 32.768KHz, 25MHz | -55°C to 125°C |
Power Manager | TPS25940-Q1 | 3.3v/1.2A, 5v/1.2A | -40°C to 125°C |
Isolator | DGQ2788A | over 15ea | -40°C to 125°C |
ESD | SP3012-06 | ElectroStatic Discharge | -40°C to 125°C |
PCB | 6 Layer | MCU fixed with epoxy adhesive |
Highlighted Features
Process subsystem input/output devices and data in various ways in the command/data processing system.
• Compliant with PC/104 standard
• Radiation/redundancy
• CubeSats can operate in environments full of radiation.
• Single event latchups and upsets occur even in low radiation environments such as polar LEO orbits.
• The physical approach, also known as radiation hardening by design, uses special radiation hardening components.
• Enhanced ICs are manufactured on insulating substrates (rather than typical semiconductor wafers) or use many roprietary design principles.
•OBC hosts walk-through design capabilities to ensure appropriate handling of radiation-related events.
• Overcurrent detection power management, separate peripheral isolator
• Full high-impedance mode requested by higher-level logic.
• Triple redundant memory or multiple onboard temperature sensor management
